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Wayne State University

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Dec 5 / as1735

U.S. Department of Homeland Security HS-STEM Summer Internship Program

Program Overview
The U.S. Department of Homeland Security (DHS) sponsors a 10-week summer internship program for students majoring in homeland security related science, technology, engineering and mathematics (HS-STEM) disciplines. This program is open to undergraduate students in a broad spectrum of DHS mission-relevant research areas and graduate students interested in the specific field of Nuclear and Radiological Threat Detection.

The DHS HS-STEM Summer Internship Program provides students with the opportunity to conduct research at federal research facilities located across the country. The goal of this program is to engage a diverse, educated, and skilled pool of scientists and engineers in HS-STEM issues and to promote long-term relationships between student researchers, DHS, and federal research facilities to enhance the HS-STEM workforce.

DHS has partnered with the Oak Ridge Institute for Science and Education (ORISE) to manage the application and review process, notification, and implementation of the program.

Undergraduate students: $5,000 stipend plus travel expenses
Areas of research: Engineering, computer science, mathematics, physics, chemistry, biological/life sciences, environmental science, emergency and incident management, social sciences

Graduate students: $7,000 stipend plus travel expenses
Areas of research: Nuclear engineering, physics, mathematics, statistics, computer sciences, systems engineering, electrical engineering, and material science

10-week research experiences offered at:
National laboratories: Argonne, Idaho, Lawrence Berkeley, Lawrence Livermore, Los Alamos, Oak Ridge, Pacific Northwest, Sandia, Savannah River
Other Research facilities: Homeland Security Studies and Analysis Institute, National Institute of Standards and Technology, Coast Guard Research and Development Center, Plum Island, and more!

U.S. citizenship required – Application deadline: January 15, 2013

More information here.

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